Bankruptcy Chapter Eleven
Dynaco intends
to remove themselves from bankruptcy by September 1, 2009. We understand
this decision to enter bankruptcy made our customers and vendors nervous but
we have been able to reduce operating cost by 40% with the restructuring and
relocation.
This reduction
of cost establishes a good foundation for the long term future of Dynaco to
continue to supply defense and aerospace rigid-flex and flexible products at
a competitive price for years to come.
Dynaco Receives
Patent for Multilayer Liquid Crystal Polymer technique.
Dynaco continues
to remain a small disadvantaged minority owned business.
Dynaco now
provides flex, rigid flex, rigid and custom bare printed circuits.
Dynaco now
offers specialized assembly on Flex, Rigid and Rigid Flex products.